Tin Plating

Alexandria Plating Industries, Inc. is provides several tin plating options including:

  • Lead Free Matte
  • Leaded Matte
  • Bright
  • Reflowed

Our wide selection of tin plating options allows us to customize electroplating and metal finishing solutions to meet the exact specifications of our clients.

Lead Free Tin Plating

Lead free tin is a soft metal that provides superior electrical conductivity and corrosion protection.  The method of plating is often used to preserve the solderability of under-plated deposits such as copper or nickel.  At least 100 grams of contact force is recommended when using Lead free tin in a contact application. Thanks to Alexandria Plating Indsutries, Inc. experience in the industry, we can recommend always utilizing a sliding or wiping action during contact engagement in lead free tin plated connector applications.  Our lead-free tin deposits meet all RoHS requirements.

    • Lead Free Bright Tin Plating

Specifications: ASTM B545, MIL-T-10727
Lead free bright tin exhibits cosmetic reflectivity and is typically used in electrical contact applications such as terminals and switching components that will not be used in solder applications. Because bright tin requires the use of organic additives that co-deposit, it is not appropriate for projects necessitating solderability.

    • Lead Free Matte Tin Plating

Specifications: ASTM B545, MIL-T-10727
Lead free matte tin is appropriate for all connector applications. Because matte tin deposits do not contain organic materials, this method is superior to that of bright tin in solderability applications.

Feel free to contact us or call 888-467-4166 for more information.

Matte and Bright Tin Lead Plating
Specifications: AMS-P-81728, ASTM B579, MIL-P-81728
Alloying matte and bright tin with lead reduces the melting point, which is favorable for applications when solderability is important. This process also prevents the formation of tin whiskers. All other performance characteristics of leaded matte and bright tin are similar to that of pure tin. Neither plating methods meet RoHS requirements.
Feel free to contact us or call 888-467-4166 for more information.

Reflowed Tin Plating
Specifications: ASTM B545, MIL-T-10727
Reflowed tin is produced by plating a pure matte tin deposit and then subjecting that deposit to a heat source that melts or “reflows” the tin deposit. The resulting deposits have a bright appearance, similar to that of bright tin, without the negative effects of co-deposited organic components. This process is often used as a whisker mitigation technique when a nickel under-plate cannot be used under the tin deposit.
Feel free to contact us or call 888-684-6248  for more information.

Process: Tin Plating (Matte and Bright)
Spec: ASTM-B-545 (Acid), 580-0605, MIL-T-10727, MIL-T-10727C
Optional metal plating services: RoHS Compliant, Nadcap Certified
Feel free to contact us or call 888-684-6248 for more information.

Process: Tin Plating (Immersion for PCBs)
Spec: 580-0798
Optional metal plating services: RoHS Compliant
Feel free to contact us or call 888-467-4166 for more information.

Process: Tin Plating (Matte 90/10 Tin and 60/40 Tin Lead Plating)
Spec: 80-0825, 580-0482, 580-0825-001, AMS P 81728, AMS P 81725, MIL-P-81728, MIL-P-81728A
Optional metal plating services: NADCAP Certified
Feel free to contact us or call 888-684-6248 for more information.

Process: Tin Plating (Matte Bismuth Tin Plating)
Spec: 580-0225, 580-0225-000, 580-0151, 580-0151-000, 952-0055, 952-0054, ASTM-B-545, ASTM B 545-97
Optional metal plating services: RoHS Compliant, Nadcap Certified
Feel free to contact us or call 888-684-6248 for more information.

Quality is Longevity!

Our QC capabilities include ANSI/ASQC Z1.4, Fischerscope, Permascope X-Ray Flourescence, Computerized Controllers, Atomic Absorption, Salt Spray and Wet Laboratories.

Military & AMS Process Specifications

QQ-C-320, QQ-N-290, MPR-1059, AMS-C-26074, MIL-C-20218, AMS-2403, AMS-2404, AMS-2405, AMS-2406, ISO1458, ISO-4526 and many others.